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MCL1005-330-R

SKU: MCL1005-330-R

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RF Inductors - SMD Chip Inductor 1*0.5*0.5mm 33nH

Introducing the high-performance multilayer chip inductor from Eaton Electronics, designed for advanced electronic applications requiring compact size and reliable performance. This SMD (Surface Mount Device) inductor measures 1.0 x 0.5 x 0.5 mm and features a fixed inductance of 33nH, making it ideal for RF and wireless communication modules.

Product Details

  • Part Number: MCL1005-330-R
  • Manufacturer: Eaton Electronics
  • Country of Origin: CN
  • Unit of Measure: Each (EA)
  • ECCN: EAR99
  • Package Type: Tape & Reel (T&R)
  • Package Dimensions: 1.0 x 0.5 x 0.5 mm
  • Datasheet: Download Datasheet

Key Features

  • Compact 0402 (1005 metric) package suitable for space-constrained designs
  • High self-resonant frequency (SRF) for RF applications
  • Multilayer monolithic construction ensures high reliability
  • Compatible with wave and reflow soldering processes
  • Inductance range from 1.0 nH to 360 nH
  • Moisture Sensitivity Level (MSL): Level 1
  • Environmental operating temperature: -55°C to +125°C

Electrical Specifications

Part Number Inductance (nH) ±5% Rated Current (mA) Minimum SRF (MHz) Test Frequency (MHz) Q (Minimum) Test Voltage (mV) Maximum DCR (Ω) @ +25°C
MCL1005-330-R 33 200 1300 200 8 100 0.10

Additional Inductance Values

Part Number Inductance (nH) ±5% Rated Current (mA) Minimum SRF (MHz) Test Frequency (MHz) Q (Minimum) Test Voltage (mV) Maximum DCR (Ω) @ +25°C
MCL1005-1R0-R 1.0 10000 400 100 8 100 0.50
MCL1005-1R1-R 1.1 10000 400 100 8 100 0.50

Environmental and Soldering Information

  • Resistant to solder reflow temperatures per J-STD-020 standards
  • Operates reliably within -55°C to +125°C ambient temperature range
  • Inductance change within ±10% at high temperature load (+125°C)
  • Q factor within ±20% at high temperature load (+125°C)

Application Areas

  • Wireless LAN
  • Bluetooth and WiFi modules
  • RF transceiver modules
  • Mobile phones and wearable devices
  • Industrial IoT connectivity
  • Machine-to-machine (M2M) communication
  • Broadband components and computing/gaming consoles

For more detailed specifications and application guidance, please refer to the datasheet.

Note: Datasheet was not processed, please search the internet for the part number for more details.

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