BOURNS LSP0600BJR-S Circuit Protection - LED Shunt Protector
The BOURNS LSP Series (Part Number: LSP0600BJR-S) is a high-reliability circuit protection device designed specifically for LED applications. This LED shunt protector functions as an electronic shunt, providing a current bypass when an LED element in a string fails open circuit. This ensures the continuous operation of the remaining LED string, making it ideal for critical lighting systems such as LCD backlighting, transport lighting, avionics, and other low-maintenance lighting solutions.
Product Features
Provides current bypass during LED open circuit failure, maintaining system integrity
Available in surface mount package (DO-214AA SMB size)
RoHS compliant for environmentally safe applications
Designed for high reliability in demanding environments
Technical Specifications
Parameter
Symbol
Value
Unit
Repetitive peak off-state voltage
VDRM
6, 9, 13, 18
V
Average on-state current
IT
1
A
Operating junction temperature
TJ
-40 to +150
°C
Storage temperature
Ts
-65 to +150
°C
Lead soldering temperature (10 s)
260
°C
Electrical Characteristics (@ TA = 25 °C)
Parameter
Test Conditions
Min.
Nom.
Max.
Unit
IDRM Repetitive peak off-state current
VD = VDRM
10
µA
V(BO) Breakover voltage
dv/dt = 750 V/ms, RSOURCE = 300
16, 18, 26, 33
V
IH Holding current
IT = 1 A, di/dt = 30 mA/ms
5
30
mA
IBO Breakover current
di/dt = 0.8 A/ms
75
mA
VT On-state voltage
IT = 1 A
1.2
V
Thermal Characteristics (@ T_A = 25 °C)
Parameter
Test Conditions
Min.
Nom.
Max.
Unit
Junction to free air thermal resistance (EIA/JESD51-3)
IT=350 mA, TA=25°C
230
°C/W
Junction to free air thermal resistance (EIA/JESD51-7)
IT=1.0 A, PCB: 75 mm x 75 mm 4-Layer, TA=25°C
90
°C/W
Package & Packaging
Unit Weight: 102 mg
Package Type: Epoxy molded SMB (DO-214AA)
Termination: Matte tin-plated over copper alloy
Packaging: EIA-481-1 standard, Tape width 12 mm, Reel diameter 330 mm, 3,000 pieces per reel
Note: The interaction between the Bourns [®] LSP device and the power supply for the LED string dictates the power supply architecture. Proper care must be taken in the design of the power supply architecture to ensure that the Bourns [®] LSP devices operate as intended and the design maintains integrity.
Datasheet was not processed please search the internet for the part number for more details.
{"id":10021354930493,"title":"LSP0600BJR-S","handle":"lsp0600bjr-s","description":"\u003ch3\u003eBOURNS LSP0600BJR-S Circuit Protection - LED Shunt Protector\u003c\/h3\u003e\n\n\u003cp\u003eThe BOURNS LSP Series (Part Number: \u003cstrong\u003eLSP0600BJR-S\u003c\/strong\u003e) is a high-reliability circuit protection device designed specifically for LED applications. This LED shunt protector functions as an electronic shunt, providing a current bypass when an LED element in a string fails open circuit. This ensures the continuous operation of the remaining LED string, making it ideal for critical lighting systems such as LCD backlighting, transport lighting, avionics, and other low-maintenance lighting solutions.\u003c\/p\u003e\n\n\u003ch3\u003eProduct Features\u003c\/h3\u003e\n\u003cul\u003e\n \u003cli\u003eProvides current bypass during LED open circuit failure, maintaining system integrity\u003c\/li\u003e\n \u003cli\u003eAvailable in surface mount package (DO-214AA SMB size)\u003c\/li\u003e\n \u003cli\u003eRoHS compliant for environmentally safe applications\u003c\/li\u003e\n \u003cli\u003eDesigned for high reliability in demanding environments\u003c\/li\u003e\n\u003c\/ul\u003e\n\n\u003ch3\u003eTechnical Specifications\u003c\/h3\u003e\n\u003ctable\u003e\n \u003ctr\u003e\n \u003cth\u003eParameter\u003c\/th\u003e\n \u003cth\u003eSymbol\u003c\/th\u003e\n \u003cth\u003eValue\u003c\/th\u003e\n \u003cth\u003eUnit\u003c\/th\u003e\n \u003c\/tr\u003e\n \u003ctr\u003e\n \u003ctd\u003eRepetitive peak off-state voltage\u003c\/td\u003e\n \u003ctd\u003eVDRM\u003c\/td\u003e\n \u003ctd\u003e6, 9, 13, 18\u003c\/td\u003e\n \u003ctd\u003eV\u003c\/td\u003e\n \u003c\/tr\u003e\n \u003ctr\u003e\n \u003ctd\u003eAverage on-state current\u003c\/td\u003e\n \u003ctd\u003eIT\u003c\/td\u003e\n \u003ctd\u003e1\u003c\/td\u003e\n \u003ctd\u003eA\u003c\/td\u003e\n \u003c\/tr\u003e\n \u003ctr\u003e\n \u003ctd\u003eOperating junction temperature\u003c\/td\u003e\n \u003ctd\u003eTJ\u003c\/td\u003e\n \u003ctd\u003e-40 to +150\u003c\/td\u003e\n \u003ctd\u003e°C\u003c\/td\u003e\n \u003c\/tr\u003e\n \u003ctr\u003e\n \u003ctd\u003eStorage temperature\u003c\/td\u003e\n \u003ctd\u003eTs\u003c\/td\u003e\n \u003ctd\u003e-65 to +150\u003c\/td\u003e\n \u003ctd\u003e°C\u003c\/td\u003e\n \u003c\/tr\u003e\n \u003ctr\u003e\n \u003ctd\u003eLead soldering temperature (10 s)\u003c\/td\u003e\n \u003ctd\u003e\u003c\/td\u003e\n \u003ctd\u003e260\u003c\/td\u003e\n \u003ctd\u003e°C\u003c\/td\u003e\n \u003c\/tr\u003e\n\u003c\/table\u003e\n\n\u003ch3\u003eElectrical Characteristics (@ TA = 25 °C)\u003c\/h3\u003e\n\u003ctable\u003e\n \u003ctr\u003e\n \u003cth\u003eParameter\u003c\/th\u003e\n \u003cth\u003eTest Conditions\u003c\/th\u003e\n \u003cth\u003eMin.\u003c\/th\u003e\n \u003cth\u003eNom.\u003c\/th\u003e\n \u003cth\u003eMax.\u003c\/th\u003e\n \u003cth\u003eUnit\u003c\/th\u003e\n \u003c\/tr\u003e\n \u003ctr\u003e\n \u003ctd\u003eIDRM Repetitive peak off-state current\u003c\/td\u003e\n \u003ctd\u003eVD = VDRM\u003c\/td\u003e\n \u003ctd\u003e\u003c\/td\u003e\n \u003ctd\u003e\u003c\/td\u003e\n \u003ctd\u003e10\u003c\/td\u003e\n \u003ctd\u003eµA\u003c\/td\u003e\n \u003c\/tr\u003e\n \u003ctr\u003e\n \u003ctd\u003eV(BO) Breakover voltage\u003c\/td\u003e\n \u003ctd\u003edv\/dt = 750 V\/ms, RSOURCE = 300\u003c\/td\u003e\n \u003ctd\u003e\u003c\/td\u003e\n \u003ctd\u003e16, 18, 26, 33\u003c\/td\u003e\n \u003ctd\u003e\u003c\/td\u003e\n \u003ctd\u003eV\u003c\/td\u003e\n \u003c\/tr\u003e\n \u003ctr\u003e\n \u003ctd\u003eIH Holding current\u003c\/td\u003e\n \u003ctd\u003eIT = 1 A, di\/dt = 30 mA\/ms\u003c\/td\u003e\n \u003ctd\u003e\u003c\/td\u003e\n \u003ctd\u003e5\u003c\/td\u003e\n \u003ctd\u003e30\u003c\/td\u003e\n \u003ctd\u003emA\u003c\/td\u003e\n \u003c\/tr\u003e\n \u003ctr\u003e\n \u003ctd\u003eIBO Breakover current\u003c\/td\u003e\n \u003ctd\u003edi\/dt = 0.8 A\/ms\u003c\/td\u003e\n \u003ctd\u003e\u003c\/td\u003e\n \u003ctd\u003e\u003c\/td\u003e\n \u003ctd\u003e75\u003c\/td\u003e\n \u003ctd\u003emA\u003c\/td\u003e\n \u003c\/tr\u003e\n \u003ctr\u003e\n \u003ctd\u003eVT On-state voltage\u003c\/td\u003e\n \u003ctd\u003eIT = 1 A\u003c\/td\u003e\n \u003ctd\u003e\u003c\/td\u003e\n \u003ctd\u003e\u003c\/td\u003e\n \u003ctd\u003e1.2\u003c\/td\u003e\n \u003ctd\u003eV\u003c\/td\u003e\n \u003c\/tr\u003e\n\u003c\/table\u003e\n\n\u003ch3\u003eThermal Characteristics (@ T_A = 25 °C)\u003c\/h3\u003e\n\u003ctable\u003e\n \u003ctr\u003e\n \u003cth\u003eParameter\u003c\/th\u003e\n \u003cth\u003eTest Conditions\u003c\/th\u003e\n \u003cth\u003eMin.\u003c\/th\u003e\n \u003cth\u003eNom.\u003c\/th\u003e\n \u003cth\u003eMax.\u003c\/th\u003e\n \u003cth\u003eUnit\u003c\/th\u003e\n \u003c\/tr\u003e\n \u003ctr\u003e\n \u003ctd\u003eJunction to free air thermal resistance (EIA\/JESD51-3)\u003c\/td\u003e\n \u003ctd\u003eIT=350 mA, TA=25°C\u003c\/td\u003e\n \u003ctd\u003e\u003c\/td\u003e\n \u003ctd\u003e\u003c\/td\u003e\n \u003ctd\u003e230\u003c\/td\u003e\n \u003ctd\u003e°C\/W\u003c\/td\u003e\n \u003c\/tr\u003e\n \u003ctr\u003e\n \u003ctd\u003eJunction to free air thermal resistance (EIA\/JESD51-7)\u003c\/td\u003e\n \u003ctd\u003eIT=1.0 A, PCB: 75 mm x 75 mm 4-Layer, TA=25°C\u003c\/td\u003e\n \u003ctd\u003e\u003c\/td\u003e\n \u003ctd\u003e\u003c\/td\u003e\n \u003ctd\u003e90\u003c\/td\u003e\n \u003ctd\u003e°C\/W\u003c\/td\u003e\n \u003c\/tr\u003e\n\u003c\/table\u003e\n\n\u003ch3\u003ePackage \u0026amp; Packaging\u003c\/h3\u003e\n\u003cul\u003e\n \u003cli\u003eUnit Weight: 102 mg\u003c\/li\u003e\n \u003cli\u003ePackage Type: Epoxy molded SMB (DO-214AA)\u003c\/li\u003e\n \u003cli\u003eTermination: Matte tin-plated over copper alloy\u003c\/li\u003e\n \u003cli\u003ePackaging: EIA-481-1 standard, Tape width 12 mm, Reel diameter 330 mm, 3,000 pieces per reel\u003c\/li\u003e\n\u003c\/ul\u003e\n\n\u003ch3\u003eAdditional Information\u003c\/h3\u003e\n\u003cul\u003e\n \u003cli\u003ePart Number: \u003cstrong\u003eLSP0600BJR-S\u003c\/strong\u003e\n\u003c\/li\u003e\n \u003cli\u003eManufacturer: \u003cstrong\u003eBOURNS\u003c\/strong\u003e\n\u003c\/li\u003e\n \u003cli\u003eCountry of Origin: \u003cstrong\u003eCN\u003c\/strong\u003e\n\u003c\/li\u003e\n \u003cli\u003eUOM: \u003cstrong\u003eEA\u003c\/strong\u003e\n\u003c\/li\u003e\n \u003cli\u003eECCN: \u003cstrong\u003eEAR99\u003c\/strong\u003e\n\u003c\/li\u003e\n \u003cli\u003eDatasheet: \u003ca href=\"https:\/\/www.waldomapac.com\/productfiles\/mf-bo\/441lsp.pdf\" target=\"_blank\"\u003eDownload Datasheet\u003c\/a\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\n\u003cp\u003eNote: The interaction between the Bourns [®] LSP device and the power supply for the LED string dictates the power supply architecture. Proper care must be taken in the design of the power supply architecture to ensure that the Bourns [®] LSP devices operate as intended and the design maintains integrity.\u003c\/p\u003e\n\n\u003cp\u003eDatasheet was not processed please search the internet for the part number for more details.\u003c\/p\u003e","published_at":"2025-08-12T15:46:27+05:30","created_at":"2025-08-12T15:46:27+05:30","vendor":"Waldom Electonics","type":"Circuit Protection","tags":["BOURN","Circuit","IMPORT_CSV","LED","WLDM"],"price":2204,"price_min":2204,"price_max":2204,"available":true,"price_varies":false,"compare_at_price":null,"compare_at_price_min":0,"compare_at_price_max":0,"compare_at_price_varies":false,"variants":[{"id":50612236878141,"title":"Default Title","option1":"Default Title","option2":null,"option3":null,"sku":"LSP0600BJR-S","requires_shipping":true,"taxable":true,"featured_image":null,"available":true,"name":"LSP0600BJR-S","public_title":null,"options":["Default Title"],"price":2204,"weight":250,"compare_at_price":null,"inventory_management":"shopify","barcode":"LSP0600BJR-S","requires_selling_plan":false,"selling_plan_allocations":[]}],"images":["\/\/thinkrobotics.com\/cdn\/shop\/files\/LSP0600BJR-S_42934832_a42d9b11.jpg?v=1754993791"],"featured_image":"\/\/thinkrobotics.com\/cdn\/shop\/files\/LSP0600BJR-S_42934832_a42d9b11.jpg?v=1754993791","options":["Title"],"media":[{"alt":null,"id":45801637806397,"position":1,"preview_image":{"aspect_ratio":1.0,"height":200,"width":200,"src":"\/\/thinkrobotics.com\/cdn\/shop\/files\/LSP0600BJR-S_42934832_a42d9b11.jpg?v=1754993791"},"aspect_ratio":1.0,"height":200,"media_type":"image","src":"\/\/thinkrobotics.com\/cdn\/shop\/files\/LSP0600BJR-S_42934832_a42d9b11.jpg?v=1754993791","width":200}],"requires_selling_plan":false,"selling_plan_groups":[],"content":"\u003ch3\u003eBOURNS LSP0600BJR-S Circuit Protection - LED Shunt Protector\u003c\/h3\u003e\n\n\u003cp\u003eThe BOURNS LSP Series (Part Number: \u003cstrong\u003eLSP0600BJR-S\u003c\/strong\u003e) is a high-reliability circuit protection device designed specifically for LED applications. This LED shunt protector functions as an electronic shunt, providing a current bypass when an LED element in a string fails open circuit. This ensures the continuous operation of the remaining LED string, making it ideal for critical lighting systems such as LCD backlighting, transport lighting, avionics, and other low-maintenance lighting solutions.\u003c\/p\u003e\n\n\u003ch3\u003eProduct Features\u003c\/h3\u003e\n\u003cul\u003e\n \u003cli\u003eProvides current bypass during LED open circuit failure, maintaining system integrity\u003c\/li\u003e\n \u003cli\u003eAvailable in surface mount package (DO-214AA SMB size)\u003c\/li\u003e\n \u003cli\u003eRoHS compliant for environmentally safe applications\u003c\/li\u003e\n \u003cli\u003eDesigned for high reliability in demanding environments\u003c\/li\u003e\n\u003c\/ul\u003e\n\n\u003ch3\u003eTechnical Specifications\u003c\/h3\u003e\n\u003ctable\u003e\n \u003ctr\u003e\n \u003cth\u003eParameter\u003c\/th\u003e\n \u003cth\u003eSymbol\u003c\/th\u003e\n \u003cth\u003eValue\u003c\/th\u003e\n \u003cth\u003eUnit\u003c\/th\u003e\n \u003c\/tr\u003e\n \u003ctr\u003e\n \u003ctd\u003eRepetitive peak off-state voltage\u003c\/td\u003e\n \u003ctd\u003eVDRM\u003c\/td\u003e\n \u003ctd\u003e6, 9, 13, 18\u003c\/td\u003e\n \u003ctd\u003eV\u003c\/td\u003e\n \u003c\/tr\u003e\n \u003ctr\u003e\n \u003ctd\u003eAverage on-state current\u003c\/td\u003e\n \u003ctd\u003eIT\u003c\/td\u003e\n \u003ctd\u003e1\u003c\/td\u003e\n \u003ctd\u003eA\u003c\/td\u003e\n \u003c\/tr\u003e\n \u003ctr\u003e\n \u003ctd\u003eOperating junction temperature\u003c\/td\u003e\n \u003ctd\u003eTJ\u003c\/td\u003e\n \u003ctd\u003e-40 to +150\u003c\/td\u003e\n \u003ctd\u003e°C\u003c\/td\u003e\n \u003c\/tr\u003e\n \u003ctr\u003e\n \u003ctd\u003eStorage temperature\u003c\/td\u003e\n \u003ctd\u003eTs\u003c\/td\u003e\n \u003ctd\u003e-65 to +150\u003c\/td\u003e\n \u003ctd\u003e°C\u003c\/td\u003e\n \u003c\/tr\u003e\n \u003ctr\u003e\n \u003ctd\u003eLead soldering temperature (10 s)\u003c\/td\u003e\n \u003ctd\u003e\u003c\/td\u003e\n \u003ctd\u003e260\u003c\/td\u003e\n \u003ctd\u003e°C\u003c\/td\u003e\n \u003c\/tr\u003e\n\u003c\/table\u003e\n\n\u003ch3\u003eElectrical Characteristics (@ TA = 25 °C)\u003c\/h3\u003e\n\u003ctable\u003e\n \u003ctr\u003e\n \u003cth\u003eParameter\u003c\/th\u003e\n \u003cth\u003eTest Conditions\u003c\/th\u003e\n \u003cth\u003eMin.\u003c\/th\u003e\n \u003cth\u003eNom.\u003c\/th\u003e\n \u003cth\u003eMax.\u003c\/th\u003e\n \u003cth\u003eUnit\u003c\/th\u003e\n \u003c\/tr\u003e\n \u003ctr\u003e\n \u003ctd\u003eIDRM Repetitive peak off-state current\u003c\/td\u003e\n \u003ctd\u003eVD = VDRM\u003c\/td\u003e\n \u003ctd\u003e\u003c\/td\u003e\n \u003ctd\u003e\u003c\/td\u003e\n \u003ctd\u003e10\u003c\/td\u003e\n \u003ctd\u003eµA\u003c\/td\u003e\n \u003c\/tr\u003e\n \u003ctr\u003e\n \u003ctd\u003eV(BO) Breakover voltage\u003c\/td\u003e\n \u003ctd\u003edv\/dt = 750 V\/ms, RSOURCE = 300\u003c\/td\u003e\n \u003ctd\u003e\u003c\/td\u003e\n \u003ctd\u003e16, 18, 26, 33\u003c\/td\u003e\n \u003ctd\u003e\u003c\/td\u003e\n \u003ctd\u003eV\u003c\/td\u003e\n \u003c\/tr\u003e\n \u003ctr\u003e\n \u003ctd\u003eIH Holding current\u003c\/td\u003e\n \u003ctd\u003eIT = 1 A, di\/dt = 30 mA\/ms\u003c\/td\u003e\n \u003ctd\u003e\u003c\/td\u003e\n \u003ctd\u003e5\u003c\/td\u003e\n \u003ctd\u003e30\u003c\/td\u003e\n \u003ctd\u003emA\u003c\/td\u003e\n \u003c\/tr\u003e\n \u003ctr\u003e\n \u003ctd\u003eIBO Breakover current\u003c\/td\u003e\n \u003ctd\u003edi\/dt = 0.8 A\/ms\u003c\/td\u003e\n \u003ctd\u003e\u003c\/td\u003e\n \u003ctd\u003e\u003c\/td\u003e\n \u003ctd\u003e75\u003c\/td\u003e\n \u003ctd\u003emA\u003c\/td\u003e\n \u003c\/tr\u003e\n \u003ctr\u003e\n \u003ctd\u003eVT On-state voltage\u003c\/td\u003e\n \u003ctd\u003eIT = 1 A\u003c\/td\u003e\n \u003ctd\u003e\u003c\/td\u003e\n \u003ctd\u003e\u003c\/td\u003e\n \u003ctd\u003e1.2\u003c\/td\u003e\n \u003ctd\u003eV\u003c\/td\u003e\n \u003c\/tr\u003e\n\u003c\/table\u003e\n\n\u003ch3\u003eThermal Characteristics (@ T_A = 25 °C)\u003c\/h3\u003e\n\u003ctable\u003e\n \u003ctr\u003e\n \u003cth\u003eParameter\u003c\/th\u003e\n \u003cth\u003eTest Conditions\u003c\/th\u003e\n \u003cth\u003eMin.\u003c\/th\u003e\n \u003cth\u003eNom.\u003c\/th\u003e\n \u003cth\u003eMax.\u003c\/th\u003e\n \u003cth\u003eUnit\u003c\/th\u003e\n \u003c\/tr\u003e\n \u003ctr\u003e\n \u003ctd\u003eJunction to free air thermal resistance (EIA\/JESD51-3)\u003c\/td\u003e\n \u003ctd\u003eIT=350 mA, TA=25°C\u003c\/td\u003e\n \u003ctd\u003e\u003c\/td\u003e\n \u003ctd\u003e\u003c\/td\u003e\n \u003ctd\u003e230\u003c\/td\u003e\n \u003ctd\u003e°C\/W\u003c\/td\u003e\n \u003c\/tr\u003e\n \u003ctr\u003e\n \u003ctd\u003eJunction to free air thermal resistance (EIA\/JESD51-7)\u003c\/td\u003e\n \u003ctd\u003eIT=1.0 A, PCB: 75 mm x 75 mm 4-Layer, TA=25°C\u003c\/td\u003e\n \u003ctd\u003e\u003c\/td\u003e\n \u003ctd\u003e\u003c\/td\u003e\n \u003ctd\u003e90\u003c\/td\u003e\n \u003ctd\u003e°C\/W\u003c\/td\u003e\n \u003c\/tr\u003e\n\u003c\/table\u003e\n\n\u003ch3\u003ePackage \u0026amp; Packaging\u003c\/h3\u003e\n\u003cul\u003e\n \u003cli\u003eUnit Weight: 102 mg\u003c\/li\u003e\n \u003cli\u003ePackage Type: Epoxy molded SMB (DO-214AA)\u003c\/li\u003e\n \u003cli\u003eTermination: Matte tin-plated over copper alloy\u003c\/li\u003e\n \u003cli\u003ePackaging: EIA-481-1 standard, Tape width 12 mm, Reel diameter 330 mm, 3,000 pieces per reel\u003c\/li\u003e\n\u003c\/ul\u003e\n\n\u003ch3\u003eAdditional Information\u003c\/h3\u003e\n\u003cul\u003e\n \u003cli\u003ePart Number: \u003cstrong\u003eLSP0600BJR-S\u003c\/strong\u003e\n\u003c\/li\u003e\n \u003cli\u003eManufacturer: \u003cstrong\u003eBOURNS\u003c\/strong\u003e\n\u003c\/li\u003e\n \u003cli\u003eCountry of Origin: \u003cstrong\u003eCN\u003c\/strong\u003e\n\u003c\/li\u003e\n \u003cli\u003eUOM: \u003cstrong\u003eEA\u003c\/strong\u003e\n\u003c\/li\u003e\n \u003cli\u003eECCN: \u003cstrong\u003eEAR99\u003c\/strong\u003e\n\u003c\/li\u003e\n \u003cli\u003eDatasheet: \u003ca href=\"https:\/\/www.waldomapac.com\/productfiles\/mf-bo\/441lsp.pdf\" target=\"_blank\"\u003eDownload Datasheet\u003c\/a\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\n\u003cp\u003eNote: The interaction between the Bourns [®] LSP device and the power supply for the LED string dictates the power supply architecture. Proper care must be taken in the design of the power supply architecture to ensure that the Bourns [®] LSP devices operate as intended and the design maintains integrity.\u003c\/p\u003e\n\n\u003cp\u003eDatasheet was not processed please search the internet for the part number for more details.\u003c\/p\u003e"}
