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XR3G6401D

SKU: XR3G6401D

Regular price ₹ 1,675.57
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OMRON ELECTRONIC COMPONENTS XR3G6401D IC Socket

Introducing the OMRON XR3G6401D IC Socket, a high-quality component designed specifically for shrink ICs with a 1.778-mm contact pitch. This socket ensures reliable electrical connections and durability in various electronic applications.

Product Features

  • Designed exclusively for shrink ICs with a 1.778-mm contact pitch
  • Round-pin type construction for enhanced longevity and shock/vibration resistance
  • No flux rise during operation
  • RoHS compliant for environmentally safe usage
  • Constructed with high-quality materials including beryllium copper, brass, PET (UL94 V-0) for base, and gold plating for contact surfaces

Technical Specifications

Contact Dimensions (mm) Base Material Inner Clips Outer Sleeves
Round pin: 0.53 dia. max. PET (UL94 V-0)/black Beryllium copper/nickel base, 0.75-μm gold plating Brass/nickel base, gold flash plating

Applicable IC Lead Dimensions

Lead Type Depth x Width (mm)
Flat leads 0.29 x 0.09 x 0.46 x 0.08 (±)
Round leads 0.53 dia. max.

Note: Do not use wire where diagonal exceeds 0.56 mm. IC lead length should be less than 3 mm to prevent IC rise.

Electrical Ratings & Characteristics

  • Rated voltage: 1 A
  • Rated current: 150 VAC
  • Contact resistance: Max. 20 mΩ (at 20 mV, 100 mA)
  • Insulation resistance: Min. 1,000 MΩ (at 500 VDC)
  • Dielectric strength: 500 VAC for 1 min (leakage current: Max. 1 mA)
  • Insertion force: Max. 3.92 N
  • Removal force: Min. 0.64 N
  • Insertion durability: 100 times (with 0.75-μm gold plating)
  • Operating temperature: -55°C to 125°C

Dimensions & Ordering Information

No. of contacts Dimensions (mm) Part Number (0.25-μm gold plating) Part Number (0.75-μm gold plating)
28 10.16 x 12.7 x 23.114 XR3G-2811 XR3G-2801
32 10.16 x 12.7 x 26.670 XR3G-3211 XR3G-3201
42 15.24 x 17.8 x 35.560 XR3G-4211 XR3G-4201
52 15.24 x 17.8 x 44.450 XR3G-5211 XR3G-5201
64 19.05 x 21.6 x 55.118 XR3G-6411 XR3G-6401

Precautions for Use

  • Soldering: Ensure outer sleeve does not protrude through circuit board holes and avoid flux entry from the top.
  • Automated Soldering: Use soldering temperature of 250 ±5°C for within 5 seconds.
  • Consult OMRON representatives for applications outside standard conditions, especially for safety-critical systems.

For detailed specifications and application guidelines, please refer to the datasheet.

Part Number: XR3G6401D
Manufacturer: OMRON ELECTRONIC COMPONENTS
Country of Origin: JP
UOM: EA
ECCN: EAR99
Package Type: Sockets and Chip Carriers

Note: The datasheet was not processed; please search the internet for the part number for more details.


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