Product Description for HSB28-606022 - 60 x 60 mm BGA Heat Sink Aluminum PCB
The HSB28-606022 is a high-quality aluminum heat sink designed specifically for BGA (Ball Grid Array) applications on PCBs. Manufactured by SAME SKY in Taiwan (COO: TW), this heat sink provides efficient thermal management to ensure optimal performance and longevity of electronic components.
Key Features
Compact 60 x 60 mm size suitable for various BGA packages
Made from durable aluminum for effective heat dissipation
Designed for PCB mounting to enhance thermal performance
This aluminum PCB heat sink is engineered to provide reliable thermal management for BGA components, helping prevent overheating and ensuring stable operation. For detailed technical specifications and installation guidelines, please refer to the datasheet.
Disclaimer
Datasheet was not processed; please search the internet for the part number HSB28-606022 for more detailed information.
{"id":10015138644285,"title":"HSB28-606022","handle":"hsb28-606022","description":"\u003ch3\u003eProduct Description for HSB28-606022 - 60 x 60 mm BGA Heat Sink Aluminum PCB\u003c\/h3\u003e\n\n\u003cp\u003eThe HSB28-606022 is a high-quality aluminum heat sink designed specifically for BGA (Ball Grid Array) applications on PCBs. Manufactured by \u003cstrong\u003eSAME SKY\u003c\/strong\u003e in Taiwan (COO: TW), this heat sink provides efficient thermal management to ensure optimal performance and longevity of electronic components.\u003c\/p\u003e\n\n\u003ch3\u003eKey Features\u003c\/h3\u003e\n\u003cul\u003e\n \u003cli\u003eCompact 60 x 60 mm size suitable for various BGA packages\u003c\/li\u003e\n \u003cli\u003eMade from durable aluminum for effective heat dissipation\u003c\/li\u003e\n \u003cli\u003eDesigned for PCB mounting to enhance thermal performance\u003c\/li\u003e\n \u003cli\u003eRoHS compliant, ensuring environmentally friendly manufacturing standards\u003c\/li\u003e\n\u003c\/ul\u003e\n\n\u003ch3\u003eSpecifications\u003c\/h3\u003e\n\u003cul\u003e\n \u003cli\u003e\n\u003cstrong\u003ePart Number:\u003c\/strong\u003e HSB28-606022\u003c\/li\u003e\n \u003cli\u003e\n\u003cstrong\u003eManufacturer:\u003c\/strong\u003e SAME SKY\u003c\/li\u003e\n \u003cli\u003e\n\u003cstrong\u003eCountry of Origin:\u003c\/strong\u003e Taiwan (TW)\u003c\/li\u003e\n \u003cli\u003e\n\u003cstrong\u003ePackage Type:\u003c\/strong\u003e EA (Each)\u003c\/li\u003e\n \u003cli\u003e\n\u003cstrong\u003eECCN:\u003c\/strong\u003e EAR99\u003c\/li\u003e\n \u003cli\u003e\n\u003cstrong\u003eProduct Type:\u003c\/strong\u003e Heat Sink\u003c\/li\u003e\n \u003cli\u003e\n\u003cstrong\u003eProduct Category:\u003c\/strong\u003e Electronic Cooling Solutions\u003c\/li\u003e\n \u003cli\u003e\n\u003cstrong\u003eUOM:\u003c\/strong\u003e EA\u003c\/li\u003e\n\u003c\/ul\u003e\n\n\u003ch3\u003eAdditional Details\u003c\/h3\u003e\n\u003cp\u003eThis aluminum PCB heat sink is engineered to provide reliable thermal management for BGA components, helping prevent overheating and ensuring stable operation. For detailed technical specifications and installation guidelines, please refer to the \u003ca href=\"https:\/\/www.waldomapac.com\/images\/parts\/largeimages\/56958757.jpg\" target=\"_blank\"\u003edatasheet\u003c\/a\u003e.\u003c\/p\u003e\n\n\u003ch3\u003eDisclaimer\u003c\/h3\u003e\n\u003cp\u003eDatasheet was not processed; please search the internet for the part number \u003cstrong\u003eHSB28-606022\u003c\/strong\u003e for more detailed information.\u003c\/p\u003e","published_at":"2025-08-11T03:11:37+05:30","created_at":"2025-08-11T03:11:37+05:30","vendor":"Waldom Electonics","type":"","tags":["60 mm","BGA","IMPORT_CSV","PCB","SAME","WLDM"],"price":92163,"price_min":92163,"price_max":92163,"available":true,"price_varies":false,"compare_at_price":null,"compare_at_price_min":0,"compare_at_price_max":0,"compare_at_price_varies":false,"variants":[{"id":50585518506301,"title":"Default Title","option1":"Default Title","option2":null,"option3":null,"sku":"HSB28-606022","requires_shipping":true,"taxable":true,"featured_image":null,"available":true,"name":"HSB28-606022","public_title":null,"options":["Default Title"],"price":92163,"weight":250,"compare_at_price":null,"inventory_management":"shopify","barcode":"HSB28-606022","requires_selling_plan":false,"selling_plan_allocations":[]}],"images":["\/\/thinkrobotics.com\/cdn\/shop\/files\/56958757.jpg?v=1754862100"],"featured_image":"\/\/thinkrobotics.com\/cdn\/shop\/files\/56958757.jpg?v=1754862100","options":["Title"],"media":[{"alt":null,"id":45770202317117,"position":1,"preview_image":{"aspect_ratio":1.0,"height":640,"width":640,"src":"\/\/thinkrobotics.com\/cdn\/shop\/files\/56958757.jpg?v=1754862100"},"aspect_ratio":1.0,"height":640,"media_type":"image","src":"\/\/thinkrobotics.com\/cdn\/shop\/files\/56958757.jpg?v=1754862100","width":640}],"requires_selling_plan":false,"selling_plan_groups":[],"content":"\u003ch3\u003eProduct Description for HSB28-606022 - 60 x 60 mm BGA Heat Sink Aluminum PCB\u003c\/h3\u003e\n\n\u003cp\u003eThe HSB28-606022 is a high-quality aluminum heat sink designed specifically for BGA (Ball Grid Array) applications on PCBs. Manufactured by \u003cstrong\u003eSAME SKY\u003c\/strong\u003e in Taiwan (COO: TW), this heat sink provides efficient thermal management to ensure optimal performance and longevity of electronic components.\u003c\/p\u003e\n\n\u003ch3\u003eKey Features\u003c\/h3\u003e\n\u003cul\u003e\n \u003cli\u003eCompact 60 x 60 mm size suitable for various BGA packages\u003c\/li\u003e\n \u003cli\u003eMade from durable aluminum for effective heat dissipation\u003c\/li\u003e\n \u003cli\u003eDesigned for PCB mounting to enhance thermal performance\u003c\/li\u003e\n \u003cli\u003eRoHS compliant, ensuring environmentally friendly manufacturing standards\u003c\/li\u003e\n\u003c\/ul\u003e\n\n\u003ch3\u003eSpecifications\u003c\/h3\u003e\n\u003cul\u003e\n \u003cli\u003e\n\u003cstrong\u003ePart Number:\u003c\/strong\u003e HSB28-606022\u003c\/li\u003e\n \u003cli\u003e\n\u003cstrong\u003eManufacturer:\u003c\/strong\u003e SAME SKY\u003c\/li\u003e\n \u003cli\u003e\n\u003cstrong\u003eCountry of Origin:\u003c\/strong\u003e Taiwan (TW)\u003c\/li\u003e\n \u003cli\u003e\n\u003cstrong\u003ePackage Type:\u003c\/strong\u003e EA (Each)\u003c\/li\u003e\n \u003cli\u003e\n\u003cstrong\u003eECCN:\u003c\/strong\u003e EAR99\u003c\/li\u003e\n \u003cli\u003e\n\u003cstrong\u003eProduct Type:\u003c\/strong\u003e Heat Sink\u003c\/li\u003e\n \u003cli\u003e\n\u003cstrong\u003eProduct Category:\u003c\/strong\u003e Electronic Cooling Solutions\u003c\/li\u003e\n \u003cli\u003e\n\u003cstrong\u003eUOM:\u003c\/strong\u003e EA\u003c\/li\u003e\n\u003c\/ul\u003e\n\n\u003ch3\u003eAdditional Details\u003c\/h3\u003e\n\u003cp\u003eThis aluminum PCB heat sink is engineered to provide reliable thermal management for BGA components, helping prevent overheating and ensuring stable operation. For detailed technical specifications and installation guidelines, please refer to the \u003ca href=\"https:\/\/www.waldomapac.com\/images\/parts\/largeimages\/56958757.jpg\" target=\"_blank\"\u003edatasheet\u003c\/a\u003e.\u003c\/p\u003e\n\n\u003ch3\u003eDisclaimer\u003c\/h3\u003e\n\u003cp\u003eDatasheet was not processed; please search the internet for the part number \u003cstrong\u003eHSB28-606022\u003c\/strong\u003e for more detailed information.\u003c\/p\u003e"}
