10cc Syringe BGA SMD Solder Soldering Paste Flux Grease RMA-223
RMA-223 is a moderately active rosin-type soldering paste that is widely used in the SMD repair process of mobile phone boards. It is a wash-free soldering paste with a very light color and a very high SIR value. It is recommended for BGA, CSP, and other ball matrix solder joint repairs and ball repairs. It provides good insulation and a smooth welding surface; it does not deteriorate or dry out. It offers good immersion and high-strength joints, and it is non-toxic and non-corrosive.
Specifications
| RMA-223 - High Viscosity No-Clean Flux |
| Can be used for PCB, BGA, PGA reworking; soldering and reballing of computer and phone chips. |
| Mixture of high-quality alloyed powder and resin pasty flux to avoid pale yellow residue — easier board cleaning. |
| Provides high joint intensity and good immersion. |
| Flux Type: RMA-223 |
| Volume: 10 ml / 10 cc |
| Length: Approx. 9.5 cm / 3.74" |
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