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1410326-3

SKU: 1410326-3

Regular price ₹ 15,238.08
Sale price ₹ 15,238.08 Regular price
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TE CONNECTIVITY/AMP BRAND Board Connector 112 Contact(s) 7 Row(s) Male Right - Part Number: 1410326-3

Optimize your aerospace, defense, and marine applications with the TE Connectivity/AMP Brand Board Connector, designed for high-performance rugged environments. This VITA 46 compatible interconnect supports data rates up to 32+ Gb/s, ensuring reliable high-speed communication in demanding military and aerospace systems.

Product Features:

  • High-Speed Performance: Supports data rates up to 32+ Gb/s, ideal for next-generation sensor systems and embedded computing applications.
  • Modular and Flexible Design: Features wafer-based contacts that can be easily modified to support specific electrical parameters such as impedance and propagation delay.
  • Rugged Construction: Designed for extreme environments with built-in ESD protection, low outgassing, and resistance to vibration and mechanical stress.
  • Open Architecture Compatibility: Aligned with SOSA™ standards, supporting open system architectures with reduced size and weight.
  • Support for VITA Standards: Fully compatible with VITA 46, 46.30, and VITA 47 environment classes, supporting VPX applications.

Technical Specifications:

Product Type Board Connector
Number of Contacts 112
Contact Arrangement 7 Rows, Male Right
RoHS Compliant No
ECCN EAR99
Package Type TUBE
UOM EA

Additional Details:

  • Part Number: 1410326-3
  • Manufacturer: TE CONNECTIVITY/AMP BRAND
  • Country of Origin: Singapore (SG)
  • Product images and datasheets available at Datasheet

Product Overview:

This high-density, rugged board connector features 112 contacts arranged in 7 rows, designed for VITA 46 VPX applications within aerospace, defense, and marine systems. Its modular wafer-based design allows customization for specific electrical and mechanical requirements, supporting high-speed data transmission with minimal size and weight. The connector's robust construction ensures durability and reliable performance in harsh environments, making it suitable for next-generation sensor and embedded computing platforms.

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