TE Connectivity AMP Brand I/O Connectors QSFP28 1x3 Cage Assembly Spring
Enhance your high-speed data transmission systems with the TE Connectivity/AMP BRAND QSFP28 1x3 Cage Assembly Spring, designed for optimal performance in data centers, network switches, servers, and high-speed interconnect applications. This connector is RoHS compliant and manufactured in China, ensuring quality and environmental standards are met.
Product Features
Supports data transfer rates of 28 Gbps NRZ and 56 Gbps PAM-4
Supports Ethernet and InfiniBand (IB) EDR requirements
Compatible with single, dual, and quad channel implementations
Provides superior signal integrity and EMI protection
Industry standard interface with backwards compatibility to QSFP+ transceivers and cables
Designed for high-density applications, including Intel Omni-Path Architecture (OPA) switch architectures
Optimized airflow with external heatsinks and air vent holes
Enhanced EMI sealing with improved spring design for better performance
Lower insertion force assembly reduces installation time by approximately 55%
Internal heatsink provides improved cooling, with a 12-15°C temperature reduction
Specifications
Part Number
2170737-2
Manufacturer
TE CONNECTIVITY/AMP BRAND
Country of Origin
CN
UOM
EA
ECCN
EAR99
Package Type
Tray
Product Details
Connector Type: I/O Connectors
Application: High-speed data communication, network infrastructure, data centers
Design Features:
EMI enhanced thermally optimized cage design
Lower assembly insertion force for faster installation
External heatsinks tailored for airflow optimization
Internal heatsink for improved cooling performance
Multiple lightpipe options for port activity indication
Rear EONs for EMI grounding and cage retention
Additional Information
For detailed technical specifications and installation guidelines, please refer to the datasheet.
Note: Datasheet was not processed, please search the internet for the part number 2170737-2 for more details.
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This connector is RoHS compliant and manufactured in China, ensuring quality and environmental standards are met.\u003c\/p\u003e\n\n\u003ch3\u003eProduct Features\u003c\/h3\u003e\n\u003cul\u003e\n \u003cli\u003eSupports data transfer rates of 28 Gbps NRZ and 56 Gbps PAM-4\u003c\/li\u003e\n \u003cli\u003eSupports Ethernet and InfiniBand (IB) EDR requirements\u003c\/li\u003e\n \u003cli\u003eCompatible with single, dual, and quad channel implementations\u003c\/li\u003e\n \u003cli\u003eProvides superior signal integrity and EMI protection\u003c\/li\u003e\n \u003cli\u003eIndustry standard interface with backwards compatibility to QSFP+ transceivers and cables\u003c\/li\u003e\n \u003cli\u003eDesigned for high-density applications, including Intel Omni-Path Architecture (OPA) switch architectures\u003c\/li\u003e\n \u003cli\u003eOptimized airflow with external heatsinks and air vent holes\u003c\/li\u003e\n \u003cli\u003eEnhanced EMI sealing with improved spring design for better performance\u003c\/li\u003e\n \u003cli\u003eLower insertion force assembly reduces installation time by approximately 55%\u003c\/li\u003e\n \u003cli\u003eInternal heatsink provides improved cooling, with a 12-15°C temperature reduction\u003c\/li\u003e\n\u003c\/ul\u003e\n\n\u003ch3\u003eSpecifications\u003c\/h3\u003e\n\u003ctable border=\"1\" cellpadding=\"5\" cellspacing=\"0\"\u003e\n \u003ctr\u003e\n \u003cth\u003ePart Number\u003c\/th\u003e\n \u003ctd\u003e2170737-2\u003c\/td\u003e\n \u003c\/tr\u003e\n \u003ctr\u003e\n \u003cth\u003eManufacturer\u003c\/th\u003e\n \u003ctd\u003eTE CONNECTIVITY\/AMP BRAND\u003c\/td\u003e\n \u003c\/tr\u003e\n \u003ctr\u003e\n \u003cth\u003eCountry of Origin\u003c\/th\u003e\n \u003ctd\u003eCN\u003c\/td\u003e\n \u003c\/tr\u003e\n \u003ctr\u003e\n \u003cth\u003eUOM\u003c\/th\u003e\n \u003ctd\u003eEA\u003c\/td\u003e\n \u003c\/tr\u003e\n \u003ctr\u003e\n \u003cth\u003eECCN\u003c\/th\u003e\n \u003ctd\u003eEAR99\u003c\/td\u003e\n \u003c\/tr\u003e\n \u003ctr\u003e\n \u003cth\u003ePackage Type\u003c\/th\u003e\n \u003ctd\u003eTray\u003c\/td\u003e\n \u003c\/tr\u003e\n\u003c\/table\u003e\n\n\u003ch3\u003eProduct Details\u003c\/h3\u003e\n\u003cul\u003e\n \u003cli\u003eConnector Type: I\/O Connectors\u003c\/li\u003e\n \u003cli\u003eApplication: High-speed data communication, network infrastructure, data centers\u003c\/li\u003e\n \u003cli\u003eDesign Features:\n \u003cul\u003e\n \u003cli\u003eEMI enhanced thermally optimized cage design\u003c\/li\u003e\n \u003cli\u003eLower assembly insertion force for faster installation\u003c\/li\u003e\n \u003cli\u003eExternal heatsinks tailored for airflow optimization\u003c\/li\u003e\n \u003cli\u003eInternal heatsink for improved cooling performance\u003c\/li\u003e\n \u003cli\u003eMultiple lightpipe options for port activity indication\u003c\/li\u003e\n \u003cli\u003eRear EONs for EMI grounding and cage retention\u003c\/li\u003e\n \u003c\/ul\u003e\n \u003c\/li\u003e\n\u003c\/ul\u003e\n\n\u003ch3\u003eAdditional Information\u003c\/h3\u003e\n\u003cp\u003eFor detailed technical specifications and installation guidelines, please refer to the \u003ca href=\"https:\/\/www.te.com\/commerce\/DocumentDelivery\/DDEController?Action=srchrtrv\u0026amp;DocNm=5-1773463-0_zQSFP_Plus_Connector\u0026amp;DocType=Data+Sheet\u0026amp;DocLang=English\u0026amp;PartCntxt=2170737-2\u0026amp;DocFormat=pdf\" target=\"_blank\"\u003edatasheet\u003c\/a\u003e.\u003c\/p\u003e\n\n\u003cp\u003eNote: Datasheet was not processed, please search the internet for the part number 2170737-2 for more details.\u003c\/p\u003e","published_at":"2025-09-06T00:45:26+05:30","created_at":"2025-09-06T00:45:26+05:30","vendor":"Waldom 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systems with the TE Connectivity\/AMP BRAND QSFP28 1x3 Cage Assembly Spring, designed for optimal performance in data centers, network switches, servers, and high-speed interconnect applications. This connector is RoHS compliant and manufactured in China, ensuring quality and environmental standards are met.\u003c\/p\u003e\n\n\u003ch3\u003eProduct Features\u003c\/h3\u003e\n\u003cul\u003e\n \u003cli\u003eSupports data transfer rates of 28 Gbps NRZ and 56 Gbps PAM-4\u003c\/li\u003e\n \u003cli\u003eSupports Ethernet and InfiniBand (IB) EDR requirements\u003c\/li\u003e\n \u003cli\u003eCompatible with single, dual, and quad channel implementations\u003c\/li\u003e\n \u003cli\u003eProvides superior signal integrity and EMI protection\u003c\/li\u003e\n \u003cli\u003eIndustry standard interface with backwards compatibility to QSFP+ transceivers and cables\u003c\/li\u003e\n \u003cli\u003eDesigned for high-density applications, including Intel Omni-Path Architecture (OPA) switch architectures\u003c\/li\u003e\n \u003cli\u003eOptimized airflow with external heatsinks and air vent holes\u003c\/li\u003e\n \u003cli\u003eEnhanced EMI sealing with improved spring design for better performance\u003c\/li\u003e\n \u003cli\u003eLower insertion force assembly reduces installation time by approximately 55%\u003c\/li\u003e\n \u003cli\u003eInternal heatsink provides improved cooling, with a 12-15°C temperature reduction\u003c\/li\u003e\n\u003c\/ul\u003e\n\n\u003ch3\u003eSpecifications\u003c\/h3\u003e\n\u003ctable border=\"1\" cellpadding=\"5\" cellspacing=\"0\"\u003e\n \u003ctr\u003e\n \u003cth\u003ePart Number\u003c\/th\u003e\n \u003ctd\u003e2170737-2\u003c\/td\u003e\n \u003c\/tr\u003e\n \u003ctr\u003e\n \u003cth\u003eManufacturer\u003c\/th\u003e\n \u003ctd\u003eTE CONNECTIVITY\/AMP BRAND\u003c\/td\u003e\n \u003c\/tr\u003e\n \u003ctr\u003e\n \u003cth\u003eCountry of Origin\u003c\/th\u003e\n \u003ctd\u003eCN\u003c\/td\u003e\n \u003c\/tr\u003e\n \u003ctr\u003e\n \u003cth\u003eUOM\u003c\/th\u003e\n \u003ctd\u003eEA\u003c\/td\u003e\n \u003c\/tr\u003e\n \u003ctr\u003e\n \u003cth\u003eECCN\u003c\/th\u003e\n \u003ctd\u003eEAR99\u003c\/td\u003e\n \u003c\/tr\u003e\n \u003ctr\u003e\n \u003cth\u003ePackage Type\u003c\/th\u003e\n \u003ctd\u003eTray\u003c\/td\u003e\n \u003c\/tr\u003e\n\u003c\/table\u003e\n\n\u003ch3\u003eProduct Details\u003c\/h3\u003e\n\u003cul\u003e\n \u003cli\u003eConnector Type: I\/O Connectors\u003c\/li\u003e\n \u003cli\u003eApplication: High-speed data communication, network infrastructure, data centers\u003c\/li\u003e\n \u003cli\u003eDesign Features:\n \u003cul\u003e\n \u003cli\u003eEMI enhanced thermally optimized cage design\u003c\/li\u003e\n \u003cli\u003eLower assembly insertion force for faster installation\u003c\/li\u003e\n \u003cli\u003eExternal heatsinks tailored for airflow optimization\u003c\/li\u003e\n \u003cli\u003eInternal heatsink for improved cooling performance\u003c\/li\u003e\n \u003cli\u003eMultiple lightpipe options for port activity indication\u003c\/li\u003e\n \u003cli\u003eRear EONs for EMI grounding and cage retention\u003c\/li\u003e\n \u003c\/ul\u003e\n \u003c\/li\u003e\n\u003c\/ul\u003e\n\n\u003ch3\u003eAdditional Information\u003c\/h3\u003e\n\u003cp\u003eFor detailed technical specifications and installation guidelines, please refer to the \u003ca href=\"https:\/\/www.te.com\/commerce\/DocumentDelivery\/DDEController?Action=srchrtrv\u0026amp;DocNm=5-1773463-0_zQSFP_Plus_Connector\u0026amp;DocType=Data+Sheet\u0026amp;DocLang=English\u0026amp;PartCntxt=2170737-2\u0026amp;DocFormat=pdf\" target=\"_blank\"\u003edatasheet\u003c\/a\u003e.\u003c\/p\u003e\n\n\u003cp\u003eNote: Datasheet was not processed, please search the internet for the part number 2170737-2 for more details.\u003c\/p\u003e"}
Using this with SIM SIM8262E-M2 with Airtel 5g sim. Working seamlessly and getting download speed upto 450 mbps and upload speed upto 60 mbps. But with jio sim only 4g is working.
