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553-0301F

SKU: 553-0301F

Regular price ₹ 160.77
Sale price ₹ 160.77 Regular price
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Product Description: DIALIGHT CORPORATION DIA PRC: DIA Part Number: 553-0301F - LED Circuit Board Indicators Bi-Level CBI

The LED Circuit Board Indicators Bi-Level CBI from DIALIGHT CORPORATION is a high-quality optoelectronic component designed for precise visual signaling applications on printed circuit boards. This RoHS-compliant indicator features dual-level bi-color illumination, making it suitable for various electronic systems requiring clear status indication.

Key Features:

  • RoHS compliant, ensuring environmentally friendly manufacturing and disposal
  • Bi-level, dual-color LED indicators for versatile signaling
  • Designed for easy integration into PCB assemblies with standard hole patterns
  • Suitable for wave soldering, dip soldering, or hand soldering using typical lead-free processes at max 260°C for 5 seconds
  • Package Type: BAG

Technical Specifications:

Parameter Details
Part Number 553-0301F
Manufacturer DIALIGHT CORPORATION
Country of Origin (COO) MY (Malaysia)
Unit of Measure (UOM) EA (Each)
ECCN EAR99
Package Type BAG
Datasheet Download Datasheet

Electrical and Optical Characteristics:

Parameter Color Min. Typ. Max. Units Conditions
Luminous Intensity Red 2.5 8.7 18 mcd I = 10 mA F
Peak Wavelength Red 635 nm
Forward Voltage Red 2.0 2.6 V I = 10 mA F
Viewing Angle All 60 Degrees

Physical and Mechanical Specifications:

  • Lead Tolerance: ±0.003 inches
  • Leads designed to fit into standard PCB hole patterns
  • Operating Temperature Range: -40°C to +85°C
  • Soldering Temperature: Max 260°C for 5 seconds

Additional Details:

For more detailed electrical characteristics, recommended hole patterns, and assembly instructions, please refer to the Datasheet.

Note: This product complies with RoHS standards. The packaging is marked with the "RoHS Compliant" label or equivalent markings. Suitable for wave, dip, or hand soldering with lead-free solder processes.

For further technical details, specifications, and application guidelines, please consult the datasheet linked above.


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