Name: MECHANIC XG Series 183°C Tin Solder Paste
Brand: ThinkRobotics
SKU: TOL2059
Price: 649.99 INR
Availability: InStock

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{"id":10271258804541,"title":"MECHANIC XG Series 183°C Tin Solder Paste","handle":"mechanic-xg-series-183-c-tin-solder-paste","description":"\u003ch2 style=\"text-align: center;\"\u003eMECHANIC XG Series 183°C Tin Solder Paste (XG50 \/ XGSP80 \/ XGZ40)\u003c\/h2\u003e\n\u003cp style=\"text-align: center;\"\u003eThe MECHANIC XG Series 183°C Tin Solder Paste is a high-performance soldering solution designed for precision electronics work, including SMD soldering, BGA reballing, IC repair, and PCB rework applications. Engineered with a eutectic Sn63\/Pb37 alloy composition, this solder paste offers a consistent melting point of 183°C, ensuring smooth solder flow, strong joint formation, and reliable conductivity.\u003c\/p\u003e\n\u003cp style=\"text-align: center;\"\u003eThe XG series is widely trusted by professionals in mobile repair, electronics manufacturing, and rework stations due to its excellent wetting performance, minimal residue, and stable viscosity. Its fine particle structure enables precise application even on densely packed PCB components.\u003c\/p\u003e\n\u003cp style=\"text-align: center;\"\u003e \u003c\/p\u003e\n\u003ch2 style=\"text-align: center;\"\u003eWhy Choose MECHANIC XG Series?\u003c\/h2\u003e\n\u003cp style=\"text-align: center;\"\u003eThe MECHANIC XG series combines precision, reliability, and ease of use, making it a preferred choice for both professionals and hobbyists. Whether you are working on fine-pitch SMD boards or complex BGA repairs, these solder pastes deliver consistent results with minimal effort.\u003c\/p\u003e\n\u003cp style=\"text-align: center;\"\u003e \u003c\/p\u003e\n\u003ch2 style=\"text-align: center;\"\u003eKey Features\u003c\/h2\u003e\n\u003ctable style=\"width: 100%; border-collapse: collapse; border: 1px solid rgb(0, 0, 0); height: 235.125px;\"\u003e\n\u003ctbody\u003e\n\u003ctr style=\"height: 39.1875px;\"\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center; height: 39.1875px; width: 50.165%;\"\u003e\u003cstrong\u003eEutectic Alloy Composition (Sn63\/Pb37)\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center; height: 39.1875px; width: 49.835%;\"\u003eProvides a sharp melting point at 183°C for uniform soldering without partial melting.\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 39.1875px;\"\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center; height: 39.1875px; width: 50.165%;\"\u003e\u003cstrong\u003eExcellent Wettability \u0026amp; Flow\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center; height: 39.1875px; width: 49.835%;\"\u003eEnsures strong, reliable solder joints with smooth spreading on pads and components.\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 39.1875px;\"\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center; height: 39.1875px; width: 50.165%;\"\u003e\u003cstrong\u003eLow Residue \u0026amp; Clean Finish\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center; height: 39.1875px; width: 49.835%;\"\u003eReduces post-solder cleaning requirements and improves overall PCB reliability.\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 39.1875px;\"\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center; height: 39.1875px; width: 50.165%;\"\u003e\u003cstrong\u003eFine Particle Size\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center; height: 39.1875px; width: 49.835%;\"\u003eSuitable for high-precision applications including BGA, QFN, and micro SMD components.\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 39.1875px;\"\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center; height: 39.1875px; width: 50.165%;\"\u003e\u003cstrong\u003eStable Viscosity\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center; height: 39.1875px; width: 49.835%;\"\u003eMaintains consistency during storage and application for controlled dispensing.\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 39.1875px;\"\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center; height: 39.1875px; width: 50.165%;\"\u003e\u003cstrong\u003eWide Application Compatibility\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center; height: 39.1875px; width: 49.835%;\"\u003eIdeal for use with hot air stations, reflow ovens, and manual soldering processes.\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003cp style=\"text-align: center;\"\u003e \u003c\/p\u003e\n\u003ch2 style=\"text-align: center;\"\u003eVariants Overview\u003c\/h2\u003e\n\u003ctable style=\"width: 100%; border-collapse: collapse; border: 1px solid #000;\"\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center; width: 50.1047%;\"\u003e\n\u003ch3\u003e\u003cb\u003eXG50\u003c\/b\u003e\u003c\/h3\u003e\n\u003c\/td\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center; width: 49.8953%;\"\u003eStandard solder paste for general SMD repair and PCB rework\u003cbr\u003eBalanced viscosity and flow performance\u003cbr\u003eTypically available in ~35g packaging\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center; width: 50.1047%;\"\u003e\n\u003ch3\u003e\u003cb\u003eXGSP80\u003c\/b\u003e\u003c\/h3\u003e\n\u003c\/td\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center; width: 49.8953%;\"\u003eEnhanced formulation for industrial and heavy-duty repair applications\u003cbr\u003eImproved stability and solder joint strength\u003cbr\u003eLarger quantity packaging (~60g) suitable for frequent use\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center; width: 50.1047%;\"\u003e\n\u003ch3\u003e\u003cb\u003eXGZ40\u003c\/b\u003e\u003c\/h3\u003e\n\u003c\/td\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center; width: 49.8953%;\"\u003eSyringe-based design with precision dispensing\u003cbr\u003eIdeal for fine-pitch components, mobile repair, and IC work\u003cbr\u003eComes with applicator\/pusher for controlled usage\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003cp style=\"text-align: center;\"\u003e \u003c\/p\u003e\n\u003ch2 style=\"text-align: center;\"\u003eApplications\u003c\/h2\u003e\n\u003ctable style=\"width: 100%; border-collapse: collapse; border: 1px solid #000;\"\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center;\"\u003eMobile phone PCB repair\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center;\"\u003eBGA chip reballing and rework\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center;\"\u003eSMD component soldering\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center;\"\u003eIC repair and replacement\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center;\"\u003eLED and microelectronics assembly\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center;\"\u003eProfessional electronics servicing and prototyping\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003cp style=\"text-align: center;\"\u003e \u003c\/p\u003e\n\u003ch2 style=\"text-align: center;\"\u003eTechnical Specifications\u003c\/h2\u003e\n\u003ctable style=\"width: 100%; border-collapse: collapse; border: 1px solid #000;\"\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center; width: 50.4986%;\"\u003e\u003cb\u003eAlloy Type\u003c\/b\u003e\u003c\/td\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center; width: 49.5014%;\"\u003eSn63 \/ Pb37\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center; width: 50.4986%;\"\u003e\u003cb\u003eMelting Point\u003c\/b\u003e\u003c\/td\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center; width: 49.5014%;\"\u003e183°C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center; width: 50.4986%;\"\u003e\u003cb\u003eForm\u003c\/b\u003e\u003c\/td\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center; width: 49.5014%;\"\u003ePaste\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center; width: 50.4986%;\"\u003e\u003cb\u003eFlux Type\u003c\/b\u003e\u003c\/td\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center; width: 49.5014%;\"\u003eRosin-based \/ No-clean (variant dependent)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center; width: 50.4986%;\"\u003e\u003cb\u003eStorage\u003c\/b\u003e\u003c\/td\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center; width: 49.5014%;\"\u003eCool and dry conditions recommended\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003cp style=\"text-align: center;\"\u003e \u003c\/p\u003e\n\u003ch2 style=\"text-align: center;\"\u003ePackage Content\u003c\/h2\u003e\n\u003cp style=\"text-align: center;\"\u003e 1x Solder Paste (XG50 \/ XGSP80 \/ XGZ40) \u003c\/p\u003e","published_at":"2026-03-19T09:25:11+05:30","created_at":"2026-03-18T16:25:12+05:30","vendor":"ThinkRobotics","type":"Solder \u0026 Flux","tags":["bga solder paste","electronics repair tools","flux paste","ic repair paste","mechanic solder paste","mobile repair solder paste","no clean solder paste","pcb rework solder","precision soldering","SLDR","SLDRNG-ACC","smd solder paste","solder paste 183c","tin paste sn63 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style=\"text-align: center;\"\u003eMECHANIC XG Series 183°C Tin Solder Paste (XG50 \/ XGSP80 \/ XGZ40)\u003c\/h2\u003e\n\u003cp style=\"text-align: center;\"\u003eThe MECHANIC XG Series 183°C Tin Solder Paste is a high-performance soldering solution designed for precision electronics work, including SMD soldering, BGA reballing, IC repair, and PCB rework applications. Engineered with a eutectic Sn63\/Pb37 alloy composition, this solder paste offers a consistent melting point of 183°C, ensuring smooth solder flow, strong joint formation, and reliable conductivity.\u003c\/p\u003e\n\u003cp style=\"text-align: center;\"\u003eThe XG series is widely trusted by professionals in mobile repair, electronics manufacturing, and rework stations due to its excellent wetting performance, minimal residue, and stable viscosity. Its fine particle structure enables precise application even on densely packed PCB components.\u003c\/p\u003e\n\u003cp style=\"text-align: center;\"\u003e \u003c\/p\u003e\n\u003ch2 style=\"text-align: center;\"\u003eWhy Choose MECHANIC XG Series?\u003c\/h2\u003e\n\u003cp style=\"text-align: center;\"\u003eThe MECHANIC XG series combines precision, reliability, and ease of use, making it a preferred choice for both professionals and hobbyists. Whether you are working on fine-pitch SMD boards or complex BGA repairs, these solder pastes deliver consistent results with minimal effort.\u003c\/p\u003e\n\u003cp style=\"text-align: center;\"\u003e \u003c\/p\u003e\n\u003ch2 style=\"text-align: center;\"\u003eKey Features\u003c\/h2\u003e\n\u003ctable style=\"width: 100%; border-collapse: collapse; border: 1px solid rgb(0, 0, 0); height: 235.125px;\"\u003e\n\u003ctbody\u003e\n\u003ctr style=\"height: 39.1875px;\"\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center; height: 39.1875px; width: 50.165%;\"\u003e\u003cstrong\u003eEutectic Alloy Composition (Sn63\/Pb37)\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center; height: 39.1875px; width: 49.835%;\"\u003eProvides a sharp melting point at 183°C for uniform soldering without partial melting.\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 39.1875px;\"\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center; height: 39.1875px; width: 50.165%;\"\u003e\u003cstrong\u003eExcellent Wettability \u0026amp; Flow\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center; height: 39.1875px; width: 49.835%;\"\u003eEnsures strong, reliable solder joints with smooth spreading on pads and components.\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 39.1875px;\"\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center; height: 39.1875px; width: 50.165%;\"\u003e\u003cstrong\u003eLow Residue \u0026amp; Clean Finish\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center; height: 39.1875px; width: 49.835%;\"\u003eReduces post-solder cleaning requirements and improves overall PCB reliability.\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 39.1875px;\"\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center; height: 39.1875px; width: 50.165%;\"\u003e\u003cstrong\u003eFine Particle Size\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center; height: 39.1875px; width: 49.835%;\"\u003eSuitable for high-precision applications including BGA, QFN, and micro SMD components.\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 39.1875px;\"\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center; height: 39.1875px; width: 50.165%;\"\u003e\u003cstrong\u003eStable Viscosity\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center; height: 39.1875px; width: 49.835%;\"\u003eMaintains consistency during storage and application for controlled dispensing.\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 39.1875px;\"\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center; height: 39.1875px; width: 50.165%;\"\u003e\u003cstrong\u003eWide Application Compatibility\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center; height: 39.1875px; width: 49.835%;\"\u003eIdeal for use with hot air stations, reflow ovens, and manual soldering processes.\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003cp style=\"text-align: center;\"\u003e \u003c\/p\u003e\n\u003ch2 style=\"text-align: center;\"\u003eVariants Overview\u003c\/h2\u003e\n\u003ctable style=\"width: 100%; border-collapse: collapse; border: 1px solid #000;\"\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center; width: 50.1047%;\"\u003e\n\u003ch3\u003e\u003cb\u003eXG50\u003c\/b\u003e\u003c\/h3\u003e\n\u003c\/td\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center; width: 49.8953%;\"\u003eStandard solder paste for general SMD repair and PCB rework\u003cbr\u003eBalanced viscosity and flow performance\u003cbr\u003eTypically available in ~35g packaging\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center; width: 50.1047%;\"\u003e\n\u003ch3\u003e\u003cb\u003eXGSP80\u003c\/b\u003e\u003c\/h3\u003e\n\u003c\/td\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center; width: 49.8953%;\"\u003eEnhanced formulation for industrial and heavy-duty repair applications\u003cbr\u003eImproved stability and solder joint strength\u003cbr\u003eLarger quantity packaging (~60g) suitable for frequent use\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center; width: 50.1047%;\"\u003e\n\u003ch3\u003e\u003cb\u003eXGZ40\u003c\/b\u003e\u003c\/h3\u003e\n\u003c\/td\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center; width: 49.8953%;\"\u003eSyringe-based design with precision dispensing\u003cbr\u003eIdeal for fine-pitch components, mobile repair, and IC work\u003cbr\u003eComes with applicator\/pusher for controlled usage\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003cp style=\"text-align: center;\"\u003e \u003c\/p\u003e\n\u003ch2 style=\"text-align: center;\"\u003eApplications\u003c\/h2\u003e\n\u003ctable style=\"width: 100%; border-collapse: collapse; border: 1px solid #000;\"\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center;\"\u003eMobile phone PCB repair\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center;\"\u003eBGA chip reballing and rework\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center;\"\u003eSMD component soldering\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center;\"\u003eIC repair and replacement\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center;\"\u003eLED and microelectronics assembly\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center;\"\u003eProfessional electronics servicing and prototyping\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003cp style=\"text-align: center;\"\u003e \u003c\/p\u003e\n\u003ch2 style=\"text-align: center;\"\u003eTechnical Specifications\u003c\/h2\u003e\n\u003ctable style=\"width: 100%; border-collapse: collapse; border: 1px solid #000;\"\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center; width: 50.4986%;\"\u003e\u003cb\u003eAlloy Type\u003c\/b\u003e\u003c\/td\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center; width: 49.5014%;\"\u003eSn63 \/ Pb37\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center; width: 50.4986%;\"\u003e\u003cb\u003eMelting Point\u003c\/b\u003e\u003c\/td\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center; width: 49.5014%;\"\u003e183°C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center; width: 50.4986%;\"\u003e\u003cb\u003eForm\u003c\/b\u003e\u003c\/td\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center; width: 49.5014%;\"\u003ePaste\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center; width: 50.4986%;\"\u003e\u003cb\u003eFlux Type\u003c\/b\u003e\u003c\/td\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center; width: 49.5014%;\"\u003eRosin-based \/ No-clean (variant dependent)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center; width: 50.4986%;\"\u003e\u003cb\u003eStorage\u003c\/b\u003e\u003c\/td\u003e\n\u003ctd style=\"border: 1px solid rgb(0, 0, 0); text-align: center; width: 49.5014%;\"\u003eCool and dry conditions recommended\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003cp style=\"text-align: center;\"\u003e \u003c\/p\u003e\n\u003ch2 style=\"text-align: center;\"\u003ePackage Content\u003c\/h2\u003e\n\u003cp style=\"text-align: center;\"\u003e 1x Solder Paste (XG50 \/ XGSP80 \/ XGZ40) \u003c\/p\u003e"}

XG50	Standard solder paste for general SMD repair and PCB rework Balanced viscosity and flow performance Typically available in ~35g packaging
XGSP80	Enhanced formulation for industrial and heavy-duty repair applications Improved stability and solder joint strength Larger quantity packaging (~60g) suitable for frequent use
XGZ40	Syringe-based design with precision dispensing Ideal for fine-pitch components, mobile repair, and IC work Comes with applicator/pusher for controlled usage

Alloy Type	Sn63 / Pb37
Melting Point	183°C
Form	Paste
Flux Type	Rosin-based / No-clean (variant dependent)
Storage	Cool and dry conditions recommended

MECHANIC XG Series 183°C Tin Solder Paste

MECHANIC XG Series 183°C Tin Solder Paste (XG50 / XGSP80 / XGZ40)

Why Choose MECHANIC XG Series?

Key Features

Variants Overview

XG50

XGSP80

XGZ40

Applications

Technical Specifications

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Eutectic Alloy Composition (Sn63/Pb37)	Provides a sharp melting point at 183°C for uniform soldering without partial melting.
Excellent Wettability & Flow	Ensures strong, reliable solder joints with smooth spreading on pads and components.
Low Residue & Clean Finish	Reduces post-solder cleaning requirements and improves overall PCB reliability.
Fine Particle Size	Suitable for high-precision applications including BGA, QFN, and micro SMD components.
Stable Viscosity	Maintains consistency during storage and application for controlled dispensing.
Wide Application Compatibility	Ideal for use with hot air stations, reflow ovens, and manual soldering processes.