Feature 1: Innovative Modular Split Design
Separates the core processing board from the microphone array board via a flexible FPC cable, enabling easy integration in space-constrained robotics and embedded applications.
For use cases such as desktop or humanoid robots, the mic array board can be positioned near the sound source, while the core board can be placed elsewhere inside the device. This design helps minimize interference from internal motor and servo noise, resulting in improved voice capture performance.
Feature 2: Flexible Array Configurations
Available in two standard configurations: 4-mic circular array for 360° spatial pickup, and 4-mic linear array for 180° directional pickup.
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Robotics In robotics applications, the circular array can be mounted on the robot’s head for omnidirectional voice capture. |
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Smart Digital Signage For smart digital signage, the linear array is well-suited for front-facing placement, optimizing voice pickup for typical user interactions directly in front of the display. |
Feature 3: XMOS XVF3800 for Advanced AI Audio Processing
on-board AI acoustic algorithms for better sound quality. Features AEC, multi-beamforming, de-reverberation, DoA, dynamic noise suppression, AGC, delivering stable and reliable voice capture performance.
AEC (Acoustic Echo Cancellation)
AEC removes acoustic echo caused when sound played from the system is picked up again by the microphone array. AEC is critical in full-duplex communication systems such as conferencing devices, voice assistants, and interactive systems.
NS (Noise Suppression)
NS reduces unwanted background noise from captured audio. By identifying and attenuating non-speech components, such as fan noise, motor and servo noise, ambient chatter, keyboard typing, or environmental hum, NS enhances the SNR (signal-to-noise ratio) in real time.
NS is essential in voice interactive systems including smart home and industrial voice control, voice assistants, educational devices, smart interactive terminals, and robots.
Feature 4: Powerful Far-Field Voice Capture
With far-field voice capture up to 5 meters and the circular 4-microphone array (100005504, 100070894) supporting precise Direction of Arrival (DoA) detection, the reSpeaker Flex delivers reliable voice capture and accurate sound source localization for interactive and voice-driven applications.
Far-field Voice Capture Up to 5m
This enables clear command recognition in larger spaces without requiring users to stand close to the device, making the reSpeaker Flex ideal for voice interactive setups like smart digital signage.
Circular 4-Microphone Array Supports 360° DoA
The circular 4-mic array enables accurate 360° DoA detection, allowing the reSpeaker Flex to identify where a voice is coming from. This spatial awareness enhances interaction performance, supports speaker tracking, provides a strong foundation for advanced beamforming, and allows users to interact with the robot from anywhere around it.
Feature 5: Compact Design for Embedded Applications
Bottom-Firing Microphones
The acoustic ports are positioned on the back side of the mic array board, reducing interference from front-facing components. This design also allows the microphones to be placed closer to the sound source or device surface, maximizing voice pickup performance.
Compact Size, Powerful Performance
With just 44 mm mic spacing and a diameter of 73 mm for the circular array, and 33 mm spacing with a length of 110 mm for the linear array, the design fits easily into space-constrained embedded applications. Despite its compact size, it delivers outstanding voice capture performance, achieved through the combination of optimized hardware design and acoustic tuning.
Feature 6: Developer-Friendly Integration
The reSpeaker Flex with no XIAO versions (100005504, 100099135) come with factory-installed USB firmware.
Plug-and-Play via USB: A standard USB interface enables quick connection to devices such as Raspberry Pi, NVIDIA Jetson, and PCs running Windows, Linux, or macOS, no drivers or complex setup required.
I2S for MCU Integration: Direct I2S support allows seamless integration with MCU platforms like the XIAO Series and Arduino, making it easy to build embedded voice-enabled applications with minimal hardware overhead.
Specification
Core Board
| Feature | Description |
|---|---|
| Core Chip | XMOS XVF3800 |
| Amplifier | Texas Instruments TPA3139D2, Supports 10W Speakers |
| Audio Algorithms | AEC, AGC, DoA, Beamforming, VAD, Noise Suppression, De-reverberation |
| USB Interfaces | 1x USB Type-C, For external connection and debugging; 1x USB JST Connector, For internal routing and motherboard integration; |
| Other Interfaces | 1x XIAO Compatible Pads; 1x XMOS XVF3800 XTAG Debug Pads; 1x XMOS XVF3800 IO Pads; |
| Audio Outputs | 1x 3.5mm Audio Jack; 1x 2-Pin Speaker Connector; |
| Power Supply | 5V Input: Via USB Type-C or 5V JST Connector; 12V Input: Via 2-Pin Terminal 12V Connector; |
| Mic Array Interface | 1x 24-Pin FPC Connector |
| Button | 1x Reset Button; 1x Boot Button; |
| Maximum Sampling Rate | 16kHz |
Mic Array Board
| Feature | Description |
|---|---|
| Microphone | 4x High-performance PDM MEMS microphones |
| Array Topology | 44 mm spacing arranged Circular Mic Array |
| Pickup Pattern | 360° omnidirectional audio capture |
| Pickup Range | Up to 5 meters |
| Interface | 1x 24-Pin FPC connector |
| Mounting | 3 × M3 mounting holes |
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